面向芯片、器件与系统的先进液态金属冷却=Advanced Liquid Metal Cooling for Chip,Device and System

  • ISBN:978-7-5478-4532-5
  • 著译者:刘静 著
  • 定价:¥598.00元
  • 出版时间:2019-12-30
  • 版次:01
  • 印次:01
  • 装帧:
  • 开本:16
  • 字数:
  • 页数:
     随着微纳电子技术的飞速发展,高集成度芯片、光电器件与系统等引发的热障问题,已成为制约其可持续发展的关键瓶颈。这种发展瓶颈对先进散热技术提出了前所未有的要求。在这种背景下,本书作者于2001年前后首次在芯片冷却领域引入具有通用性的液态金属散热技术,随后在国内外引发重大反响和后续大量研究,成为近年来该领域内前沿热点和极具应用前景的重大发展方向之一。影响范围甚广,正为能源、电子信息、先进制造、国防军事等领域的发展带来颠覆性变革,并将催生出一系列战略性新兴产业。 为推动这一新兴学科领域的可持续健康发展,本书作者将其十七八年的研究成果系统梳理和总结,编撰成本专著。本书系统围绕液态金属散热技术,集中阐述了其中涉及的新方法、新原理与典型应用,基本涵盖了液态金属芯片散热领域中的所有重大主题,包括:液态金属的基础热物理特性、流动特性、材料相容性、驱动方法、传热特性、微通道散热技术、相变热控技术以及一些实际器件的应用等方面,学科领域跨度大,内容崭新,系国内外该领域首部著作,是一本兼具理论学术意义和实际参考价值的学术著作。以英文版推出,是为了更好地将中国原创科研成果推向国际,因此,具有非常及时和重要的出版价值。
目  录

 

 

Chapter 1Introduction1

 

1.1Increasing Challenges in Advanced Cooling2

1.2Water Cooling and New Alternatives4

1.3Basic Features of Conventional Heat Exchangers6

1.3.1Heat Exchanger Classification by Geometry and 

Structure7

1.3.2Heat Exchange Enhancement Techniques12

1.4Limitations of Waterbased Heat Exchanger13

1.4.1Overall Properties of Water13

1.4.2Adhesion and Cohesion14

1.4.3Surface Tension14

1.4.4Specific Heat14

1.4.5Conductivity15

1.5Liquid Metal Coolant for Chip Cooling15

1.6Some Facts about Liquid Metal17

1.7Revisit of Traditional Liquid Metal Cooling19

1.8Liquid Metal Enabled Innovation on Conventional 

Heat Exchanger22

1.9Potential Application Areas of Liquid Metal Thermal 

Management 23

1.9.1Chip Cooling23

1.9.2Heat Recovery25

1.9.3Energy System27

1.9.4Heat Transfer Process Engineering28

1.9.5Aerospace Exploration28

1.9.6Appliances in Large Power Systems29

1.9.7Thermal Interface Material29

1.9.8More New Conceptual Applications31

1.10Technical and Scientific Challenges in Liquid Metal 

Heat Transfer 32

1.11Conclusion35

References36

Chapter 2Typical Liquid Metal Medium and Properties for Advanced 

Cooling44

 

2.1Typical Properties of Liquid Metals45

2.1.1Low Melting Point45

2.1.2Thermal Conductivity45

2.1.3Surface Tension48

2.1.4Heat Capacity49

2.1.5Boiling Temperature50

2.1.6Subcooling Point50

2.1.7Viscosity51

2.1.8Electrical Properties52

2.1.9Magnetic Properties52

2.1.10Chemical Properties52

2.2Alloy Candidates with Low Melting Point53

2.2.1Overview53

2.2.2GaIn Alloy53

2.2.3NaK Alloy55

2.2.4Woods Metal55

2.3Nano Liquid Metal as More Conductive Coolant or Grease55

2.3.1Technical Concept of Nano Liquid Metal55

2.3.2Performance of Typical Nano Liquid Metals56

2.4Liquid Metal Genome towards New Material Discovery61

2.4.1About Liquid Metal Material Genome61

2.4.2Urgent Needs on New Liquid Metals62

2.4.3Category of Room Temperature Liquid Metal Genome62

2.5Fundamental Routes toward Finding New Liquid Metal Materials64

2.5.1Alloying Strategy from Single Metal Element64

2.5.2Making Composite from Binary Liquid Alloys65

2.5.3Realizing Composite from Multicomponent Liquid Alloys66

2.5.4Nano Technological Strategies66

2.5.5Additional Physical Approaches66


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